Nex Robotics Pvt. Ltd. - Latest Products from Category: PCBs

Bread Board

Fri, 18 Jun 2010 02:36:22 +0100

Bread Board is used to make Temporary circuits for a Testing having size of 175x67x8mm. Containing 128 group of 5 connected terminals, 8 Bus of 25 connected terminal.
Price: Rs.100.00

General Purpose PCB(22cm x 19cm )

Fri, 16 Jan 2009 05:36:47 +0100

This is a high quality glass epoxy general purpose PCB having Size: 22cm x 19cm. It is used for rapid prototyping design.
Price: Rs.352.80

General Purpose PCB (10.4cm x 8.4cm)

Mon, 10 May 2010 04:24:50 +0100

This is a high quality glass epoxy general purpose PCB. It is used for prototyping.
Price: Rs.88.20

PCB Cleaning

Fri, 18 Jun 2010 02:38:59 +0100

PCB Cleaning is used to clean the PCB.
Price: Rs.21.00

Universel 0.65mm 160 Pin QFP PCB

Tue, 24 Feb 2009 03:42:33 +0100

This is universal PCB for QFP packages with 0.65mm pitch. QFP package IC with up to 160 pins can be soldered on this board.
Price: Rs.78.75

Universel 0.5mm 160 Pin QFP PCB

Tue, 24 Feb 2009 03:28:41 +0100

This is universal PCB for QFP packages with 0.5mm pitch. QFP package IC with up to 160 pins can be soldered on this board.
Price: Rs.73.50

TQFP-100 Expansion Board

Mon, 23 Feb 2009 23:28:04 +0100

TQFP-100 package Ic can be soldered on this board. This board can be mounted on any general purpose PCB like NR-B-GP-001.
Price: Rs.89.25

General Purpose PCB 2mm Pitch (8.5cm x 5.5cm )

Fri, 16 Jan 2009 05:41:18 +0100

This is a high quality glass epoxy general purpose PCB having Size: 8.5cm x 5.5cm . It is used for rapid prototyping design.
Price: Rs.63.00

LQFP-48 Expansion Board

Mon, 12 Oct 2009 04:26:22 +0100

LQFP-48 package Ic can be soldered on this board. This board can be mounted on any general purpose PCB like NR-B-GP-001.
Price: Rs.42.00

TSSOP14 Expansion Board

Fri, 16 Jan 2009 06:02:10 +0100

TSSOP14 package Ic can be soldered on this board.
Price: Rs.15.75

TQFP-80 Expansion Board

Fri, 16 Jan 2009 05:53:23 +0100

TQFP-80 package Ic can be soldered on this board.
Price: Rs.70.35